1 > Wireless | BLE TLSR826X


Wireless | BLE TLSR826X
Product Page
Documentation
Development Kits

본문

 

  TLSR826X

 



[TLSR8267 SoC Pin Layout]


    

 

[TLSR8267 SoC Block Diagram] 

 






 

 

 

 


 

 

Target Standard

 

 ▶ BLE 4.2, BLE Mesh

 

Interfaces


 ▶ I/O : SPI, USB2.0, I2C, UART, Debug
 ▶ Up to 36/21 GPIOs
 ▶ Voice In : Digital and Analog Mic
 ▶ Audio out : SDM, Mono
 ▶ PWM : Up to 6 Channel, 2-channel IR

 

Performance


 ▶ RF Sensitivity : 

          -92dBm @BLE 1Mbps


 ▶ Power@3.0V :
          TX 15mA@0dBm 

          RX 12mA


 ▶ Sleep with SRAM : <2uA


 ▶ Max RF power : +7dBm

Package


 ▶ QFN 32 / QFN 48


 

Features
 ▶ 32bit MCU, up to 48MHz

     Internal 512KB Flash
      Embedded 32KB SRAM 

 

 ▶ BOM saving
     32K crystal no needed
     Embedded RF match circuit
     Minimal external passive components

 

 ▶ Power
     Embedded LDO, DC-DC Converter
     Low battery detection


 ▶ Sensor support
     14bits ADC with PGA
     Temperature sensor